MultiPhy will be discussing its FlexPhy 100G DSP-based technology at ECOC, the largest conference on optical communication in Europe. The event will take place on Sept 17-21 in Gothenburg, Sweden.
MultiPhy will be attending DGCON, an Israeli conference focused on Hardware Design. Our partner, Amphenol will be presenting a case study of our EVB design at the event.
MultiPhy will be attending ChipEx, a leading event for microelectronic technology and chip design in Tel Aviv, Israel. Looking forward to seeing you there.
Ever-increasing social networking and cloud based apps are driving hyper-scale data center giants such as Google, Amazon and Microsoft to keep up with scalable infrastructure and network connectivity. MultiPhys’ advanced DSP and mixed signal based ultra-high speed PHY ICs are revolutionizing connection speeds, addressing the capacity challenge of Data Center build outs.
As a global, dynamic company with engineering teams and customer presence in Israel, North America and China, you will experience technology at its cutting edge, at 100Gb/s and above speeds implemented in advanced CMOS process nodes. Join us and be part of a talented team and a company that’s celebrated in the industry for its innovative, superior development and products.
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